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  r08ds0037ej0100 rev.1.00 page 1 of 10 aug 03, 2011 preliminary data sheet PH5551A2NA1-E4 ambient illuminance sensor description the PH5551A2NA1-E4 is a digital ambient illuminance sensor for i 2 c bus interfaces and includes a 16-bit ad converter. this product has spectral characteristics clos e to human eye sensitivity and outputs digital signals corresponding to the ambient brightness. the PH5551A2NA1-E4 can be used to improve the performance and reduce the power consumption of digital equipment such as fpd tv sets and mobile phones, by enabling automatic brightness control and automatic switching on and off of lighting systems. features ? small and thin son package 2.55 x 1.56 x 0.55 mm ? built-in 16-bit ad converter ? i 2 c bus interface ? spectral characteristics close to human eye sensitivity peak sensitivity wavelength 560 nm typ. ? wide illuminance range 1 to 65,535 lx ? i 2 c slave address selectable 2 types ? interrupt function ? pb-free applications ? fpd tv sets, displays ? mobile phones, smartphones ? notebook pcs, tablet pcs ? dscs, dvcs ? fa equipments ? lighting systems, etc. r08ds0037ej0100 rev.1.00 aug 03, 2011
PH5551A2NA1-E4 chapter title r08ds0037ej0100 rev.1.00 page 2 of 10 aug 03, 2011 package dimensions (unit: mm) 1 3 6 4 bottom view top view side view (0.25) 0.55 0.5 0.2 0.22 0.2 1.560.15 2.550.2 2.25 2 5 remark pin 1 is distinguishable by the shape of the lead frame. remark ( ) indicates nominal dimensions. pin no. terminal i/o function 1 v dd ? supply voltage 2 gnd ? gnd 3 addr_sel i slave address (2 addresses selectable) 4 scl i i 2 c bus scl 5 int o interrupt 6 sda io i 2 c bus sda
PH5551A2NA1-E4 chapter title r08ds0037ej0100 rev.1.00 page 3 of 10 aug 03, 2011 absolute maximum ratings (t a = 25 c, unless otherwise specified) parameter symbol ratings unit supply voltage v dd 4.5 v power dissipation *1 p d 135 mw operating temperature t a ? 30 to +85 c storage temperature t stg ? 40 to +100 c note: *1. mounted on glass epoxy board (18 mm 13 mm t 0.8 mm) recommended operating conditions parameter symbol min. typ. max. unit supply voltage v dd 2.4 3.0 3.6 v electro-optical characteristics (t a = 25 c, v dd = 3.0 v, unless ot herwise specified) parameter symbol conditions min. typ. max. unit supply current 1 i dd1 ev = 100 lx *1 130 290 a supply current 2 i dd2 ev = 100 lx *1 , power-down 1 a dark sensor output ? ev = 0 lx 4 count peak sensitivity wavelength p 560 nm h-resolution mode resolution hrm 1 lx l-resolution mode resolution lrm 16 lx measurement time in h-resolution mode hrt 330 495 ms measurement time in l-resolution mode lrt 21 32 ms i 2 c scl clock frequency f scl 400 khz i 2 c bus free time t buf 1.3 s i 2 c hold time for start condition t hdsta 0.6 s i 2 c set-up time for start condition t susta 0.6 s i 2 c set-up time for stop condition t susto 0.6 s i 2 c data hold time t hddat 0 0.9 s i 2 c data set-up time t sudat 100 ns i 2 c ?l? period of the scl clock t low 1.3 s i 2 c ?h? period of the scl clock t high 0.6 s i 2 c ?l? output voltage at sda v ol 0 0.4 v note: *1 fluorescent light
PH5551A2NA1-E4 chapter title r08ds0037ej0100 rev.1.00 page 4 of 10 aug 03, 2011 i 2 c bus interface specification 1. i 2 c bus interface timing chart sda scl t f ssrps t hdsta t low t r t hddat t sudat t f t susta t high t hdsta t susto t r t buf s :start condition sr :repeated start condition p :stop condition 2. slave address two slave addresses are selectable. the slave ad dress is determined by the addr_sel pin. when addr_sel = ? h ? , the address is ? 1100100 ?. when addr_sel = ? l ? , the address is ? 0111001 ?. 3. i 2 c protocols (1) write format a/a s msb slave address r/w '0' (write) aa data data data p data transferred (n bytes + acknowledge) a = acknowledge (sda = low) a = not acknowledge (sda = high) s = start condition p = stop condition from master to slave from slave to master (2) read format s msb slave address r/w '1' (read) a data data data p data transferred (n bytes + acknowledge) a = acknowledge (sda = low) a = not acknowledge (sda = high) s = start condition p = stop condition from master to slave from slave to master a a
PH5551A2NA1-E4 chapter title r08ds0037ej0100 rev.1.00 page 5 of 10 aug 03, 2011 instruction code and register map 1. instruction code the instruction code is specified after the slave address. 0 1 0 1 0 0 0 0 default bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reg_sel ap_cnt adr_ptr pwr *1 note: *1 there are two pwr bits, one in the instruction code and one in the control register. when one bit changes, the other bit also changes at the same time. (1) reg_sel: register selecti on for write or read operation code register address selection write operation read operation 00 control register control register control register 01 measurement register control register measurement register 10 measurement register ? measurement register (2) ap_cnt: address pointer control code description 00 the address is fixed to the regist er address specified by adr_ptr. 01 the register address is incremented when one item of data is written or read. 10 if these bits are read after being written, the current register address is output. (3) adr_ptr: register address specify the address of the register to be written or read by using these 3 bits. (4) pwr: power on/power down power on/power down (1: power on)
PH5551A2NA1-E4 chapter title r08ds0037ej0100 rev.1.00 page 6 of 10 aug 03, 2011 2. register map the register map is specified after the instruction code. (1) control register (a) register address: 000 0 0 0 0 0 0 0 0 default bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reserved swrst intclr int_cond rsltn int_en *2 pwr *1 notes: *1 there are two pwr bits, one in the instruction c ode and one in the control register. when one bit changes, the other bit also changes at the same time. *2 there are two int_en bits in the control register . when one bit changes, the other bit also changes at the same time. swrst : register reset (initial values are restored by setting this bit to 1.) intclr : interrupt source clear (1: clear interrupt source) int_cond : interrupt result (00: no comparison with threshold value; 01: measured lux is lower than lower-limit threshold value; 11: measured lux is higher than upper-limit threshold value.) rsltn : resolution selection (1 lx/16 lx) (0 : 1 lx resolution; 1: 16 lx resolution) int_en : interrupt enable/disable (1: enable interrupts) pwr : power on/power down (1: power on) (b) register address: 001 0 0 0 0 0 0 0 0 default bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 lower interrupt generation threshold when interrupts are enabled - lower 8 bits (c) register address: 010 0 0 0 0 0 0 0 0 default bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 lower interrupt generation threshold when interrupts are enabled - higher 8 bits (d) register address: 011 0 0 0 0 0 0 0 0 default bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 upper interrupt generation threshold when interrupts are enabled - lower 8 bits (e) register address: 100 0 0 0 0 0 0 0 0 default bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 upper interrupt generation threshold when interrupts are enabled - higher 8 bits
PH5551A2NA1-E4 chapter title r08ds0037ej0100 rev.1.00 page 7 of 10 aug 03, 2011 (f) register address: 101 0 0 0 0 0 0 0 0 default bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reserved reserved reserved stop int_count int_at_rt int_en *1 note: *1 there are two int_en bits in the control regist er. when one bit changes, the other bit also changes at the same time. stop : stops lux measurement after the current adc cycl e. the lux data measured last is retained. the adc enters standby mode.(1: stop) int_count : how many times the upper or lower thresh old value is exceeded in succession before an interrupt signal is generated. (00: once; 01: 4 times; 10: 8 times; 11: 16 times) int_at_rt : automatic restoration from interrupt enable/disable (0: processing automatically restored; 1: proce ssing not automatically re stored (restored after the interrupt is cancelled by the system)) int_en : interrupt enable/disable (0: disable interrupts; 1: enable interrupts) 3. measurement register (a) register address: 000 0 0 0 0 0 0 0 0 default bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 measurement of lux - lower 8 bits (read only) (b) register address: 001 0 0 0 0 0 0 0 0 default bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 measurement of lux - higher 8 bits (read only)
PH5551A2NA1-E4 chapter title r08ds0037ej0100 rev.1.00 page 8 of 10 aug 03, 2011 taping specifications (unit: mm) outline and dimensions (tape) tape direction outline and dimensions (reel) symbol dimensions (mm) a b w symbol dimensions (mm) c d e 130.2 2.00.5 21.00.8 180 +0 ?1.5 60 +1 ?0 9.0 +1 ?0 1 2 e w d c ba 2 1 perforation direction of feed product carrier tape cover tape product pin 1 2.00.1 4.00.1 0.20.05 0.780.05 3.50.05 1.750.1 8.00.2 0.780.05 2.9 1.95 4.00.1 1.050.05 1.5 +0.1 ?0 90 120
PH5551A2NA1-E4 chapter title r08ds0037ej0100 rev.1.00 page 9 of 10 aug 03, 2011 recommended mount pad dimensions (unit: mm) 0.24 0.24 0.22 0.5 0.5 0.5 0.5 0.22 0.22 0.22 1.85 0.55 remark all dimensions in this figure must be evaluated before use.
PH5551A2NA1-E4 chapter title r08ds0037ej0100 rev.1.00 page 10 of 10 aug 03, 2011 notes on handling 1. recommended reflow soldering conditions (including infrared reflow, convection reflow, and infrared + convection reflow) (1) this product is dry-packed with desiccan t in order to avoid moisture absorption. (2) after breaking the seal, reflow soldering must be done within 168 hours under the recommended temperature profile shown below. (3) if more than 168 hours have passed after breaking the seal, the baking process must be done by using a tape and reel. baking conditions: once, with tape and reel, 60 5 c, 10 to 24 hours after the baking process, this product must be stored under conditions of 30 c or below, 70% rh or below, and reflow soldering must be done within 168 hours. < storage conditions after breaking seal > ? storage conditions : 30 c or below, 70% rh or below ? maximum storage period after breaking seal : 168 hours (second reflow soldering must be completed within 168 hours.) < reflow soldering conditions > ? peak reflow temperature : 260 c or below (package surface temperature) ? maximum number of reflows : 2 ? no repair by hand soldering ? maximum chlorine content of rosin flux (percentage mass) : 0.2% or less time recommended temperature profile of reflow package surface temperature 60 to 120 s 220 c 255 c 8 min. max. 150 c ramp-up rate 3 c/s max. ramp-down rate 6 c/s max. peak temperature 260 c max. 30 s or less 60 s or less 200 c
all trademarks and registered trademarks are t he property of their respective owners. c - 1 revision history ph5551a 2na1-e4 data sheet description rev. date page summary 1.00 aug 03, 2011 ? first edition issued
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